Don’t worry about this USB Drive
“The industry leading SIP (System-In- Package) manufacturing process involves advanced wire-bonding, stacking, and encapsulation stages which result in several key advantages.”
“Since SIP technology can provide complete encapsulation and protection of the flash components and contacts, this give ample protection for Petito from water, shock, dust, and ESD.”
You can read all about it in the ATP Whitepaper.
posted by Henry Marcos at 2:57 PM